Principles of Power Integrity for PDN Design-Simplified: Robust and Cost Effective Design for High Speed Digital Products

Consistently Design PDNs That Deliver Reliable Performance at the Right Cost

Too often, PDN designs work inconsistently, and techniques that work in some scenarios seem to fail inexplicably in others. This book explains why and presents realistic processes for getting PDN designs right in any new product. Drawing on 60+ years of signal and power integrity experience, Larry Smith and Eric Bogatin show how to manage noise and electrical performance, and complement intuition with analysis to balance cost, performance, risk, and schedule. Throughout, they distill the essence of complex real-world problems, quantify core principles via approximation, and apply them to specific examples. For easy usage, dozens of key concepts and observations are highlighted as tips and listed in quick, chapter-ending summaries.

Coverage includes
- A practical, start-to-finish approach to consistently meeting PDN performance goals
- Understanding how signals interact with interconnects
- Identifying root causes of common problems, so you can avoid them
- Leveraging analysis tools to efficiently explore design space and optimize tradeoffs
- Analyzing impedance-related properties of series and parallel RLC circuits
- Measuring low impedance for components and entire PDN ecologies
- Predicting loop inductance from physical design features
- Reducing peak impedances from combinations of capacitors
- Understanding power and ground plane properties in the PDN interconnect
- Taming signal integrity problems when signals change return planes
- Reducing peak impedance created by on-die capacitance and package lead inductance
- Controlling transient current waveform interactions with PDN features
- Simple spreadsheet-based analysis techniques for quickly creating first-pass designs

This guide will be indispensable for all engineers involved in PDN design, including product, board, and chip designers; system, hardware, component, and package engineers; power supply designers, SI and EMI engineers, sales engineers, and their managers.

Larry D. Smith is a Principal Power Integrity Engineer at Qualcomm. Prior to joining Qualcomm in 2011, he worked at Altera from 2005 to 2011 and Sun Microsystems from 1996 to 2005, where he did development work in the field of signal and power integrity. Before this, he worked at IBM in the areas of reliability, characterization, failure analysis, power supply and analog circuit design, packaging, and signal integrity. Mr. Smith received the BSEE degree from Rose-Hulman Institute of Technology and the MS degree in material science from the University of Vermont. He has more than a dozen patents and has authored numerous journal and conference papers.

Eric Bogatin is currently the Dean of the Teledyne LeCroy Signal Integrity Academy, at www.beTheSignal.com, an Adjunct Professor at the University of Colorado-Boulder in the ECEE department, and editor of the Signal Integrity Journal (www .SignalIntegrityJournal.com). Bogatin received his BS in physics from MIT and MS, and PhD in physics from the University of Arizona in Tucson. He has held senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft, and Interconnect Devices. He has written six technical books in the field and presented classes and lectures on signal integrity worldwide. In 2011, his company Bogatin Enterprises, which he founded with his wife Susan in 1990, was acquired by Teledyne LeCroy. After concluding his live public classes in 2013, he devoted his efforts into creating the Signal Integrity Academy, a web portal to provide all of his classes and training content online for individuals and for companies. In addition to lecturing and writing on signal and power integrity topics, Bogatin also writes science fiction novels. The first in a series, Shadow Engineer, was published in 2016.