Exploring Java 9: Build Modularized Applications in Java

Exploring Java 9: Build Modularized Applications in Java

  • 作者: Cheng, Fu
  • 原文出版社:Apress
  • 出版日期:2017/12/02
  • 語言:英文
  • 定價:1140
  • 運送方式:
  • 臺灣與離島
  • 海外
  • 可配送點:台灣、蘭嶼、綠島、澎湖、金門、馬祖
  • 可取貨點:台灣、蘭嶼、綠島、澎湖、金門、馬祖
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內容簡介

Discover all the new features and changes in Java 9, including module systems--JPMS or Project Jigsaw. This book covers the whole Java application development life cycle. You’ll review all the important concepts, including module descriptor, unnamed module, automatic module, and command line tools.
Exploring Java 9 also serves as a practical guide for migration to module systems. Code samples from real-world scenarios solidify a foundation for learning and development and allow you to apply best practices in actual development.
Additionally, you’ll learn about concurrency, ECMAScript 6 features in Nashorn and Parser API, stack-walking API, Stream and Optional, utilities classes, and I/O. And it’s now possible to build modularized applications in Java. You’ll see how JPMS affects not only the JDK itself, but also applications that are developed upon it.
What You’ll Learn
- Build modularized applications in Java - Migrate to module systems - Master enhanced method handles

Who This Book Is ForJava developers with basic development skills

 

作者簡介

Fu Cheng is a software developer living in Auckland, New Zealand with rich experience in applying best practices in real product development and strong problem solving skills.
He is the author of Build Mobile Apps with Ionic 2 and Firebase by Apress and Understanding Java 7: The Core Techniques and Best Practices (Simplified Chinese edition), which covers the new features of Java SE 7 and provides a deep dive of Java platform core features, including JVM internals, byte code manipulation, class loader, generics, security, concurrent programming and serialization.
He is also a regular writer on the IBM developerWorks China and InfoQ China website with more than 50 published technical articles covering various technical topics.


 

詳細資料

  • ISBN:9781484233290
  • 規格:平裝 / 174頁 / 25.4 x 17.8 x 1 cm / 普通級
  • 出版地:美國

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