Innovative Food Processing and Packaging Technologies: Present and Future

Innovative Food Processing and Packaging Technologies: Present and Future

  • 定價:15000

分期價:(除不盡餘數於第一期收取) 分期說明

3期0利率每期50006期0利率每期2500
  • 運送方式:
  • 臺灣與離島
  • 海外
  • 可配送點:台灣、蘭嶼、綠島、澎湖、金門、馬祖
  • 可取貨點:台灣、蘭嶼、綠島、澎湖、金門、馬祖
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內容簡介

Innovative Food Processing and Packaging Technologies: Present and Future presents the latest information about technologies that are currently under research and can be transferred to the industry shortly. It also provides information about other novel technologies that are started to be investigated but show potential use in the industry, like PEF, cold plasma, megasonic, radiofrequency, infrared, nanotechnology technologies. This book also includes the most recent information regarding the novel packaging technologies and packaging materials in the food science/food engineering arena, examples include packaging aspects, food regulations, plant-based alternatives to animal foods, consumer phobia/acceptance of new technologies. A special section includes information about novel ingredients and product development. This book also covers the point of view of industry and equipment manufacturers related to novel technologies. The consumer role in accepting novel technologies and products is also presented, making it a unique resource to researchers, graduate students and professionals in the food industry.

 

詳細資料

  • ISBN:9780323917421
  • 規格:平裝 / 普通級 / 初版
  • 出版地:美國

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